Abstract
A new 2D (two-dimensional) in-plane sensitive Hall-effect sensor comprising two identical n-Si Greek-crosses is presented. Each of the crosses contains one central square contact and, symmetrically to each of their four sides, an outer contact is available. Outer electrode from one configuration is connected with the respective opposite contact from the other configuration, thus forming four parallel three-contact (3C) Hall elements. These original connections provide pairs of opposite supply currents in each of the cross-Hall structure. Also the obligatory load resistors in the outer contacts of 3С Hall elements are replaced by internal resistances of crosses themselves. The samples have been implemented by IC technology, using four masks. The magnetic field is parallel to the structures’ plane. The couples of opposite contacts of each Greek-cross are the outputs for the two orthogonal components of the magnetic vector at sensitivities S ≈ 115 V/AT whereas the cross-talk is very promising, reaching no more than 2.4%. The mean lowest detected magnetic induction B at a supply current Is = 3 mA over the frequency range f ≤ 500 Hz at a signal to noise ratio equal to unity, is Bmin ≈ 14 μT.
Highlights
The measurement of more than one orthogonal component of magnetic field vector using single-chip approach is the most advanced problem in the multidimensional microsystems
The multidimensional device consists of two identical n-Si Greek-crosses, Figure 1
Each outer terminal from a given configuration is connected to the respective opposite contact from the other arrangement, C3–C9, C4–C10, C5–C7 and C6–C8, forming four parallel 3C Hall elements
Summary
The measurement of more than one orthogonal component of magnetic field vector using single-chip approach is the most advanced problem in the multidimensional microsystems This method provides advantages as high spatial resolution and minimal operational volume, drastically improved orthogonality between the two or three axes, the position of the device with respect to the magnetic source is not critical, very good electrical, thermal and galvanomagnetic compatibility in individual sensor channels etc. The most advanced 2D and 3D vector configurations use the Hall effect, since their action involves only one simple, well-defined and well-investigated physical principle, [1,2,3,4,5,6,7,8] These microsensors, irrespective of the pronounced progress, with respect to channel sensitivities, cross-talk, technology compatibility etc. Proceedings 2018, 2, 711 orthogonal in-plane magnetic-field components using simple construction, improved cross-talk and satisfactory resolution is presented
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