Abstract
Numerical computational fluid dynamics simulations have been performed on 2D sandwich models to compare the performance of low‐temperature cofired ceramics (LTCC)/LTCC and Si/Si sandwiches used in reactive bonding. In the sandwich model layers of solder, silver and a reactive multilayer used to bond the substrates are modeled. Additional to this, the surrounding air environment is also modeled. For simulating the heat released by the multilayer system, a user‐defined function in the form of a square wave is written for the heat source with a defined width, corresponding to the reaction width, and this propagates at a fixed speed. Two sandwiches, one with LTCC/LTCC, and the other with Si/Si, are simulated and their response analyzed in terms of the solidification/melting of the solder and their respective time–temperature histories.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
