Abstract
We developed a novel type of bending testing device to study the mechanical properties of structural thin films commonly used in MEMS devices at the temperature from room temperature to 100℃. Tests were carried out by out-of-plane bending of cantilever specimens with two-step width, in which the stress concentration point shifted to inside corner of the width step from the fixed end. In this test, no variation of bending strength between two temperatures was observed from the measured load and displacement graphs and SEM photograph of the fractured specimen. Fracture started at the area close to the stress concentration and propagated in an oblique direction through the thickness occurred in the high stress concentrated area of narrow width portion.
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