Abstract
A 3D microsystem for multi-site penetrating extracellular neural recording from the brain is presented. A 16 times 16-channel neural recording interface integrated prototype fabricated in 0.35 mum CMOS occupies 3.5 mm times 4.5 mm area. Each recording channel dissipates 15 muW of power with input-referred noise of 7 muV <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">rms</sub> over 5 kHz bandwidth. A switched-capacitor delta read-out data compression circuit trades recording accuracy for the output data rate. An array of 1.5 mm platinum-coated microelectrodes is bonded directly onto the die. Results of in vitro experimental recordings from intact mouse hippocampus validate the circuit design and the on-chip electrode bonding technology.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
