Abstract
AbstractIn the manufacturing process of the display module assembly, from the integration of PCB and LCD glass to each module to be assembled, there will be a lot of transferred moving and contacted behavior by equipment or personnel, inevitably. Therefore, the ESD and EOS phenomenon occurring in those production processes will impact the reliability of finished or semi‐finished products owing to the damage of ESD/EOS sensitive semiconductor elements. The failure processes and root causes have been addressed to improve the production yield of LCM for display panels.
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