Abstract

AbstractProgress in the development of a fully roll‐to‐roll self‐aligned imprint process for producing active matrix backplanes with submicron aligned features on flexible substrates is reported. High performance transistors, crossovers and addressable active matrix arrays have been designed and fabricated using imprint lithography. Such a process has the potential of significantly reducing the costs of large area displays. The progress, current status and remaining issues of this new fabrication technology are presented.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call