Abstract

Plastic deformation and fracture behavior of ultrafine-grained Cu processed by ECAP (Equal Channel Angular Pressing) was observed by EBSD (Electron Backscatter Diffraction) method. Specimens processed by ECAP with grain size of d=300nm and annealed counterpart with d=40 micrometer was deformed under uniaxial tensile loading followed by EBSD measurement. The result shows that the transgranular strain represented by GOS (Grain Orientation Spread) doesn't increase regardless of the applied plastic strain in ultrafine-grained specimens processed by ECAP. The change in the distribution of the transgranular strain in a grain was analyzed by GROD (Grain Reference Orientation Deviation) map. It was found that the distribution of the transgranular strain changes with the increasing plastic strain, indicating that the plastic deformation and fracture behavior is governed by the rearrangement of the strain in a grain.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call