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Abstract
For brittle materials, there is a critical depth of cut between ductile mode and brittle mode. However, the critical depth of cut is very small. In order to increase the critical depth of cut, ductile mode cutting of single crystal silicon was realized using ultrasonic vibration. The ultrasonic vibration of 27kHz was applied to a diamond tool in the cutting direction. In the case of conventional cutting without ultrasonic vibration, the critical depth of cut was 0.15μm. On the other hand, in the case of ultrasonic vibration cutting, the critical depth of cut was increased to 8.5μm. The mechanism of material removal in the ultrasonic vibration cutting of single crystal silicon was also discussed.
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