Abstract

Screen-printing Ag paste on the rear side of the Tunnel Oxide Passivated Contact solar cells (TOPCon) is still the mainstream method to form electrodes. However, the high price of precious metals increases the cost of TOPCon cells. Al is a cheap and high-performance conductor, and its work function is compatible with the rear side of TOPCon cells. In this study, we used a UV pulse laser (355 nm, 10 ps) to ablate the rear side SiNx passivation layer of TOPCon cells and then printed Al paste with different weight percentages of silicon (Si-wt.%) on the phosphorus-doped polycrystalline silicon (n+-poly-Si) layer to reduce the cost. We investigated the damage mechanism of laser on SiOx/n+-poly-Si/SiNx passivation structure and the contact mechanism between Al paste and n+-poly-Si layer. The results show that the Voc of SiOx/n+-poly-Si/SiNx passivation structure reduced about 6–7 mV when the laser energy density was 0.431 J/cm2. We got the best electrical performance of TOPCon cells printed with Al paste (25 wt%-29 wt% silicon). The open-circuit voltage (Voc) and the conversion efficiency (Eff), have reached 663.60 mV and 22.56 % respectively. Although the efficiency was 9.40 % relative lower than that of TOPCon cells printed with Ag paste, but the cost of Al paste only accounted for 10 % of Ag paste. In the future, the highest Eff of TOPCon solar cells printed with Al paste on the rear side are expected to reach the commercial TOPCon based on Ag paste, which applies laser doping selective emitter technology (SE) and bifacial poly-Si passivation structure.

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