219 光放射圧を利用した微粒子操作によるマイクロ加工に関する研究(OS-2 機械加工(1))

Abstract

This paper presents a new micro-machining using optical radiation pressure induced by incident laser light, which is based on laser trapping technology. In order to verify the feasibility of our proposed micro-machining technology, we performed the fundamental experiments based on the simulation results. As a result, we found that the proposed micro-machining will make it possible to effectively remove the surface up to the depth of several nm using the diamond grain rotated by the radiation pressure, even if the pressure force is as small as 0.1 nN.