21702 高周波動作を行う集積回路における熱応力とそのlow-k材料への影響 : 稼動中の集積回路におけるlow-k材料の新たな信頼性問題(配線1,OS.12 機械工学が支援する微細加工技術(半導体・MEMS・NEMS))

Abstract

The ULSI is a composite system made from many materials and the stress is generated caused by the mismatch of the thermal expansion. The reliability issue related with the thermal stress is mainly discussed about the thermal history of the fabrication processes. However, the global bus line is facing a new mode of failure during operation because of the increased thermal power at high speed operation and the reduced strength of low-k dielectric material. It has been pointed out that attention should be paid to thermal stress in designing the floor plan of the global bus lines.