Abstract
The focus of this study is to clarify effects of interface wedge condition in ceramic side on the bonding strength of ceramic to metal joint. Each plate Si_3N_4 to Ni joint with plane interface is produced by electric discharge machining. Geometrical interface shape at the edge of the interface is characterized by wedge angle in both sides of the ceramic and metal defined as a configuration angle between free surface of each material and the interface. As the wedge angle of Ni is right angle, the wedge angle of Si_3N_4 is set over 30°≤φ_1≤180°. Tensile bonding strength of the ceramic to metal joint is evaluated to obtain a valid evidence of the optimum interface shape. Result of this study shows that decrease of the optimum wedge angle of ceramic side improves the bonding strength since it decreases the residual stress near edge of the interface on ceramic side. This paper provides a useful geometrical interface shape to improve tensile bonding strength of ceramic to metal joint.
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