Abstract
We studied whether nanometer thick ZnO layer was effective as an adhesion layer between glass and Cu. The adhesion strength was evaluated with a scratch tester and the films and interfaces were characterized with scanning transmission electron microscopy. The Cu films were deposited on ZnO layer by using three methods vacuum deposition, supercritical fluid chemical deposition, and electroless plating. Adhesion strengths of the glass/ZnO/Cu increased when 10 nm thick ZnO layer was used. In addition, when Pd nanoparticles were deposited on ZnO surface before Cu deposition, the adhesion strength increased STEM-EDX analysis revealed that the high adhesion strength was due to the presence of an extremely thin (approximately 10 nm) intermixing layer consisting of Cu, Pd, Zn, O, and Si.
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