Abstract
In electronic packages such as BGA and LGA packages, it is very important for the reliability of packages to reduce the residual stress on the surface of the semiconductor chip. In this research, the authors proposed the evaluation method to predict the electronic characteristic changes of stress-induced multilayer chip in resin-molded electronic packages. The developed technique considering the stress singular field and piezo resistance matrix made it possible to predict electronic characteristic changes of multilayer chips in resin-molded electronic packages accurately.
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