Abstract
This paper describes the development of a new laser soldering technique for surface mount assemblies. The new technique, using a focused YAG laser beam, has a superior performance. It can be applied to TCP (Tape Carrier Package) assemblies for fine pitch leads and offers a no-bridge soldering process. A new beam-scanning technique was used to accomplish a high speed soldering process. First, the performance of preheating method was evaluated, and this method proved most effective in TCP assembly. Second, to obtain more flexibility in assembly, the new beam-scanning technique, which provided beam-resting time on pads of PCB (Printed Circuit Board), was investigated. The beam-resting time was determined by theoretical and experimental analysis of solder melting volume. From these results, it was shown that the new laser soldering beam-scanning technique offers the capability to assemble high lead counts and fine pitch leads such as TCP.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Journal of the Japan Society for Precision Engineering
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
