2,6‐Diamino‐4‐phenylphenol (DAPP) copolymerized polyimides: synthesis and characterization

Abstract

AbstractNovel soluble copolyimides containing phenyl and hydroxyl pendant groups were synthesized from pyromellitic dianhydride (PMDA) and two diamines, 2,6‐diamino‐4‐phenylphenol (DAPP) and 4,4′‐oxydianiline (ODA), in various ratios via thermal imidization. The structures and physical properties of the copolyimides were characterized by FTIR, elemental analysis, DSC, dynamic mechanical analysis (DMA), TGA, a universal testing machine for stress–strain behaviour, and a dielectric analyzer to study the effect of DAPP on the physical properties of the modified polymers. Copolyimides containing more than 40 mol% DAPP were soluble in hot N‐methyl‐2‐pyrrolidone (NMP), dimethylacetamide (DMAc) and dimethylformamide (DMF), and possessed a high glass transition temperature (358 °C) and a high modulus (3.9 GPa). Introduction of the diamine DAPP could also reduce the dielectric constant. A segment of imide linkages could convert to benzoxazole linkages by decarboxylation at temperatures higher than 420 °C under vacuum. Although the heat‐treated polybenzoxazoles (PBOs) exhibited many good properties, they were found to be too rigid and brittle to be processable for microelectronic applications. Copyright © 2005 Society of Chemical Industry