Abstract
Interdigital pair bonding (IPB) is proposed as a means to fabricate piezoelectric composites used for ultrasonic transducers and arrays for medical imaging and nondestructive evaluation, especially in the high frequency range. This letter presents experimental results of prototype 2–2 piezoelectric composites made by IPB. Two composites with different lateral dimensions were fabricated using 70 and 40 μm thickness dicing saw blades. The widths of ceramic stripe and epoxy kerf for composite A are 53 and 12 μm, respectively, and are 36 and 4 μm for composite B. The thickness mode and lateral modes for both composites were investigated by impedance spectrum analysis. The kt for both samples is 0.64. The current designs permit the fabrication of composites for transducers operated up to approximately 50 MHz using conventional dicing saw blades. The extension of IPB to fabrication of 1–3 composite is discussed.
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