1929 鉛フリーはんだのエレクトロマイグレーション耐性評価に関する研究(J16-4 電子情報機器,電子デバイスの熱制御と強度・信頼性評価(4),J16 電子情報機器,電子デバイスの熱制御と強度・信頼性評価)

Abstract

The present paper proposes a simple method to test electromigration resistance of solders. One of the key points of the present method is the fabrication of a simple solder sample that can produce sufficient current density to cause electromigration. Moreover, the actual local temperature of a small area subjected to electromigration in the sample is measured by a direct method. By comparing the electromigration behavior of Pb-free solders as a function of current density, associated time and electromigration temperature, the corresponding resistances of the solders against electromigration will be evaluated.