Abstract
AbstractIn 1977, an LCD (Liquid Crystal Display) panel using ACF (Anisotropic Conductive Film) was manufactured for the first time, in history. Since then, ACF has been recognized as an indispensable material for assembling FPD (Flat Panel Display) modules. Due to the remarkable developments in LCD, and expansion of the field of LCD applications, the properties and features of ACF have simultaneously been improving (e.g., reliability of interconnection, compatibility for finer pitch patterning, and demand for both low‐temperature and short processing time during main bonding process) and have assumed a role as an important element contributing to the growth of the FPD industry. In recent years, ACF has also had seen an expansion of its usage in a wide variety of applications for electric interconnect, not only in FPD modules, but also for Semiconductor Packaging, RF‐ID and replacement for conventional mechanical connecter.
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