Abstract
It is known that there is a threshold current density of electromigration damage in the via-connected line. The evaluation of the threshold current density is one of the great interests from the viewpoint of IC reliability. In this study, a metal line with two-dimensional shape, i.e. an angled metal line is treated. The evaluation method of the threshold current density is applied to the metal line. The method is based on the numerical simulation of the building-up process of the atomic density distribution in bamboo lines by using the governing parameter for electromigration damage. Comparing the evaluated results with that of straight-shaped line, the effect of line-shape on the threshold current density of electromigration damage is discussed. Furthermore, the obtained difference in the threshold current density is verified experimentally.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
