Abstract
1851 ビルドアップ基板の寿命推定技術 : ビルドアップ絶縁材料の熱酸化と強度低下(J09-3 プリント基板接続信頼性,J09 電子情報機器,電子デバイスの熱制御と強度・信頼性評価)
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