Abstract
This paper describes acoustic visualization of initiation and propagation of the crack in the interfacial layer of the Sn-3.8Ag-1.2Cu alloy solder joints under repeated loading through acoustic microscope. The initiation and propagation of the periphery crack at the bonded area were observed in acoustic images as the brightness change in the bonded area with increasing fatigue cycles. The estimated bonding area was linearly decreased according to the increase in the fatigue cycles. The observation of the fracture surface showed that a lot of void of about several 10μm size appeared at the interface of the solder joints, and dispersed small voids were observed as the gray area in the acoustic image. The intermetallic compounds were observed on the fracture surface where the periphery crack propagated.
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