Abstract
The effect of grain boundary microstructure such as grain boundary connectivity and spatial distribution of the grain boundaries on propagation path in sulfur-doped nickel was investigated to reveal the utility of grain boundary engineering for control of fracture resistance to impurity segregation-induced embrittlement in polycrystalline materials. Crack predominantly propagated along high energy random boundaries. Thus, the deflection of crack propagation path strongly depended on the connectivity of random boundaries associated with grain size and shape. Crack propagation rate was found to decrease and branching of cracks occurred when the front of crack reached to low-E coincidence site lattice boundaries.
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