Abstract
This paper describes the thermal analysis of Printed Circuit Board (PCB). Because the modeling of PCB has hitherto been very poor, the thermal simulation results cannot satisfy the required accuracy. To solve this problem, we divide into each layer that constitutes the PCB, and considers that each layer is a homogeneous material. And the thermal conductivity of every layer is computed with reference to the wiring area ratio. However, by this method, the anisotropic thermal conductivity of PCB cannot be modeled. Then we divide the PCB into a set of blocks and computed each thermal conductivity in consideration of the wiring area ratio and the wiring direction with reference to the wiring diagram, and created the analysis model reflecting the anisotropic thermal conductivity of PCB.
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