Abstract

We present a novel type of 1300-nm horizontal-cavity surface-emitting buried heterostructure distributed feedback (DFB) lasers showing high optical output power and uncooled direct modulation capability of 7.5 Gb/s. These lasers can be fabricated and tested using on-wafer techniques only, so the overall fabrication costs are considerably lower than with conventional edge-emitting DFB lasers.

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