Abstract
Friction stir spot welding (FSSW) method is the solid state bonding at extremely low temperatures by friction heat. Therefore bonding strength by FSSW show superior tensile strength compared to the conventional melting welding, FSSW has been widely recognized at efficient and useful welding method. In this study was two copper thin plate was welded by the friction stir micro spot welding with sub-millimeter spot size. Then, the welding properties for various welding conditions, tool rotating speed and the pressing displacement, were evaluated the applicability of this new FSSW method to electronic devices.
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