Abstract
Effect of heat treatment on the fatigue strength of electroplated copper thin films was investigated. Test electroplated copper films were grown on stainless steel substrates by using acid copper sulfate bath without any additive agent. These films were annealed at 400℃ for 3 hours in argon atmosphere. Mechanical properties of annealed film were similar to that of bulk material because the grain size of the films was increased by annealing. It was also found that the fracture mode of the annealed films changed drastically. The annealed film showed ductile fracture though the initial film without annealing showed brittle fracture. The high cycle fatigue strength of the as-electroplated films was lower than that of the annealed films. This was because that the micro structure of the film consisted of fine columnar grains with weak grain boundaries.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
