Abstract
This study was carried out to develop 120 W class light-emitting diode (LED) security lights with smaller heat dissipation devices by improving the heat dissipation efficiency compared to existing security lights. Four 30 W class chip-on-board (COB) LED modules were placed in a luminaire, with three modules subjected to forced heat dissipation using thermoelectric elements. The thermoelectric element and LED module were packaged as a unit to improve the performance of the thermoelectric element, and the unit satisfied the optimal conditions for low power energy consumption of the thermoelectric element. When the electric power was 6.4 W, a 24.9% temperature decrease was achieved at the lowest temperature of the metal-core printed circuit board (76.2℃) through forced heat dissipation. Based on the results, the arithmetic lifespan of the LED light could be extended by 100.5%.
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