Abstract
microLEDs present a number of unique challenges in testing and inspection because of their unique structure and tiny size. In the earlier days of microLEDs, the greatest hurdles to overcome were miniaturization, chip design, and mass transfer. And while solutions for these challenges continue to evolve, today's most critical obstacles are of a different sort. The most fundamental problem in microLED manufacturing today is the very low yield in manufacturing. As a result, the industry is in need of effective testing and high‐throughput inspection equipment in order to enable high volume production.
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