Abstract
When we estimate the fatigue life of lead-free solder joints under cyclic temperature load, we have to get mechanical properties of them and conduct FE analysis using the FE technology which can exhibit these properties. We think stress strain curves and stress relaxation curves containing these temperature dependencies and these rate dependencies as examples of these mechanical properties of these solder joints under cyclic temperature load, hi addition, these solder joints under cyclic temperature load are stressed mainly in shear and the solder alloys have scale effect. Thus in this study, for FE analysis of solder joints under cyclic temperature load, we carried out tensile tests and the stress-relaxation tests of lead-free solder alloy using the micro-shear specimen.
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