Abstract
This study provides creep properties of lead free solder alloy Sn-3Ag-0.5Cu based on indentation method and dependence of indentation creep exponent index on temperature condition each manufacturing history of a solder alloy. Specimens used for this experiment were cut out of as rolled solder alloy and as cast one. Dependence of indentation creep exponent on temperature condition of indentation was clarified experimentally. Experimental results showed indentation creep exponent slightly decreases with increase of temperature condition independent of materials history, but both average of the exponent indexes were not agreement. Difference between both mechanical strength properties under tensile test may relate to experimental results. Dependence of mechanical strength properties on manufacturing history of solder were related to the experimental results.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
