Abstract
This study provides creep properties of lead free solder alloy Sn-3Ag-0.5Cu based on indentation method and dependence of indentation creep exponent index on temperature condition each manufacturing history of a solder alloy. Specimens used for this experiment were cut out of as rolled solder alloy and as cast one. Dependence of indentation creep exponent on temperature condition of indentation was clarified experimentally. Experimental results showed indentation creep exponent slightly decreases with increase of temperature condition independent of materials history, but both average of the exponent indexes were not agreement. Difference between both mechanical strength properties under tensile test may relate to experimental results. Dependence of mechanical strength properties on manufacturing history of solder were related to the experimental results.
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