Abstract
In the study of copper corrosion, a microfluidic device was used to provide an experimentally controlled environment of flux and atmosphere. Copper layer formed by the sputtering method reacted with gas controlled water which was four kinds of concentration of oxygen and carbon dioxide each high and low. Linear flow velocities (LV) above the copper layer were 30, 50 and 70 cm/s, and the flow time for all experiments was 120 min. After each flow tests, the copper layer surface was observed using SEM, while the roughness was measured using AFM. In the case of LV 50 cm/s, copper layer was most corroded in the case of oxygen and carbon dioxide both high, and secondly corroded in the case of only oxygen high. The case of only carbon dioxide high and the case of both gas low were slightly corroded and were not very different from before test. These results were thought to reflect a two-step reaction of copper oxidation and dissolution.
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