Abstract
A nonwarped substrate is required for manufacturing processes of a semiconductor device or a liquid crystal display. However it is difficult to fabricate a nonwarped substrate, since a thin substrate cannot be chucked during the polishing process without deformation occurring. A freezing pin chuck has been developed to resolve this problem. This paper describes the chucking characteristics of a freezing pin chuck. As a result, it was demonstrated that this chuck could be used for polishing a quartz glass substrate.
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Schedule a callMore From: Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21
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