Abstract
We demonstrate very-high-density ferroelectric recording experiments of 1 Tbit/in.2 in polycrystalline Pb(Zr,Ti)O3 (PZT) thin film for the first time. A high-quality polycrystalline PZT thin film was successfully deposited on a silicon substrate with a SrRuO3 (SRO) electrode by metal–organic chemical vapor deposition (MOCVD). The roughness of the PZT film was reduced to less than 1 nm by chemical mechanical polishing (CMP). The PZT film has very high controllability for domain inversion. Our fabrication process also enables high productivity. Therefore, our PZT film has potential to be a mass-productive ferroelectric recording medium for high-density storage systems.
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