1 - Soldering process

Abstract

Publisher Summary This introductory chapter explains important aspects of soldering in electronics assemblies. It also serves as a guide indicating the places where relevant and important information is to be found within the rest of the book. Soldering process is used in the electronics industry to bond components together, forming one or more electrical connections. Soldering serves two functions: mechanical support—holding components of an assembly together, and electrical support—forming required electrical connections within a circuit. All types of soldering processes for all types of assemblies can be categorized in just two groups: CS soldering processes and SC soldering processes. Component/solder (CS) processes position components onto the printed circuit board then apply solder. There are three main CS soldering processes: dip soldering, drag soldering, and wave soldering. Solder/component (SC) soldering processes, on the other hand, apply solder before positioning components onto printed circuit boards. These processes are used primarily in surface mounting assembly production, where solder and flux are applied as a paste followed by the placement of components and the application of heat.