Abstract

Deposition technology can well be regarded as the major key to the creation of devices such as computers, since microelectronic solid-state devices are all based on material structures created by thin-film deposition. Thin-film deposition technologies are classified into four major generic categories: evaporative methods, glow-discharge processes, gas phase chemical processes, and liquid-phase chemical film formation techniques. It is possible to a large degree to tailor the deposition process to the specific needs, based on: physical and chemical material characteristics, specific applications, advantages and limitations in process technology, and manufacturing technology and equipment. The fabrication processes established for semiconductor devices during the past several years have provided an important stimulus for the development of new thin-film materials, processes and equipment. Another important reason for the rapid growth of deposition technology is the improved understanding of the physics and chemistry of films, surfaces, interfaces, and microstructures made possible by the remarkable advances in analytical instrumentation during the past several years. A better fundamental understanding of materials leads to expanded applications and new designs of devices that incorporate these materials. A good example of the crucial importance of deposition technology is the fabrication of semiconductor devices, an industry that is totally dependent on the formation of thin solid films of a variety of materials by deposition from the gas, vapor, liquid, or solid phase.

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