Abstract
1-3 ceramic/polymer composites based on high Curie temperature ferroelectric ceramic BiScO3–PbTiO3 (BSPT) were fabricated using the dice and fill method. The electromechanical coupling factor kt of BSPT composite was found to be 58% at room temperature, higher than the thickness coupling factor of monolithic BSPT ∼50%. In addition, BSPT 1-3 composite exhibits high thermal stability of electromechanical properties and low dielectric loss up to 300 °C, making it a potential candidate for broad-bandwidth transducer applications at elevated temperatures.
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