Abstract
This paper presents the assessment of thermal fatigue life scatter of solder joints for chip components. Crack path simulation was carried out by using the finite element method. Fatigue life was evaluated based on Manson-Coffin's law and Miner's rule. Analysis was designed by using an orthogonal table and the response surface methodology was used to demonstrate the sensitivity analysis. The case study to evaluate the worst and best values of fatigue lives shows the large difference in fatigue life. Asymmetrical solder joints have the larger dispersion of fatigue life because the chip component has two solder joints influencing on each other. It means that the interaction between both solder joints affects the dispersion of thermal fatigue life.
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