Abstract
The new polishing method to easily control to make arrangement of abrasive particles onto the polishing area using functional fluid under low frequency AC electric field are developed. In this method, we introduced the multi-layered concentric electrode to previous method for polishing of relatively thick and nonconductive material plates as glass and semiconductor. It is clarified that the motion of abrasives can be controlled by AC electric field on the basis of in-situ observation during polishing. After choosing of optimum polishing conditions, borosilicate glass plates were polished. That surface roughness was reduced from 13.5nmRa to 7.5nmRa after 3min. The multi-layer concentric electrode showed about 1/5 treatment time shorter than the conventional polishing method without AC electric field.
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