Abstract

Gallium Oxide has undergone rapid technological maturation over the last decade, pushing it to the forefront of ultra-wide band gap semiconductor technologies. Maximizing the potential for a new semiconductor system requires a concerted effort by the community to address technical barriers which limit performance. Due to the favorable intrinsic material properties of gallium oxide, namely, critical field strength, widely tunable conductivity, mobility, and melt-based bulk growth, the major targeted application space is power electronics where high performance is expected at low cost. This Roadmap presents the current state-of-the-art and future challenges in 15 different topics identified by a large number of people active within the gallium oxide research community. Addressing these challenges will enhance the state-of-the-art device performance and allow us to design efficient, high-power, commercially scalable microelectronic systems using the newest semiconductor platform.

Highlights

  • The wafer size is limited to 100 mm. Another emerging class of devices are based on AlGaN/GaN high-electron-mobility transistors (HEMTs), which can be built on low-cost 200 mm Si wafers on which a thin (∼few μm) GaN-based layer is grown by metal organic chemical vapor deposition (MOCVD).[2]

  • For Pulse Width Modulated (PWM) converters, the switch rise and fall times must be negligible as compared to both carrier frequency and minimum duty cycle—this is important to maintain low switching losses

  • halide vapor phase epitaxy (HVPE) or MOCVD is a candidate of the epitaxial growth method for vertical power devices that require a thick film, while MOCVD or molecular beam epitaxy (MBE) is a candidate for lateral power devices that require a film with a flat surface

Read more

Summary

INTRODUCTION

A materials result has the power to rally the research community around a new semiconductor technology. The large bandgap and field strength have created a new set of problems for materials and device researchers. To this date, avalanche breakdown has not been measured in β-Ga2O3. This enabled the device community to make quick strides in fabricating high performance devices. For each chapter in this Roadmap, the state of the art is described briefly followed by an analysis of the most important technical barriers in each respective section This serves as a call to action, for if the community can address these barriers, it will enable β-Ga2O3 to be the commercialized semiconductor. AN OUTLOOK TO THE COMMERCIAL MARKET OPPORTUNITIES OF β-Ga2O3 BASED POWER DEVICES

Status of the area
Lack of a p-type
The lack of p-type may also be a problem for junction termination design
Wafer size limitation
Several poly-types
E-mode device design
Concluding remarks
DEFENSE BASED POWER CONVERTER APPLICATIONS
Current and future challenges
Gate driver requirements
Topology and controls considerations
Projected β-Ga2O3 switch performance and comparison to GaN devices
Next generation power systems
ECONOMIC MODEL
Substrates
Epitaxial wafers
BULK GROWTH
Key challenges
Vertical Bridgman
Status
MBE: Growth rate
Epitaxy
METALORGANIC VAPOR PHASE EPITAXY
Substrate orientation and growth window
Material purity
Dopants and defects
Alloys and heterostructures
VIII. OTHER GROWTH METHODS
Halide vapor phase epitaxy
Mist chemical vapor deposition
Pulsed laser deposition
CHARACTERIZATION
FUNDAMENTAL MATERIALS AND TRANSPORT PROPERTIES
AlGaO properties
Impact ionization parameters
SCHOTTKY BARRIER DIODES
On-resistance limit
Edge termination
Barrier height control
Thermal management
VERTICAL DEVICES
Design similarities between a trench SBD and a FinFET
Threshold voltage control and stability
Reliability of MIS structures for reaching high fields in β-Ga2O3
Current aperture employing semi-insulating β-Ga2O3
P–n heterojunctions
XIII. LATERAL DEVICES
DIELECTRIC ENGINEERING
Challenges
ULTRA-HIGH k DIELECTRICS
THERMAL MANAGEMENT
Thermal characterization
Device-level thermal management
Additional prospects
Findings
XVII. CLOSING REMARKS
Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.