周期加熱サーモリフレクタンス法による Cu-Pt 合金薄膜の熱伝導率測定

Abstract

A novel thermal conductivity measurement technique combining a periodically modulated thermoreflectance method with numerical simulation has been developed to precisely estimate the thermal conductivity of sub-micrometer thickness metal films. Numerical simulation about the surface temperature response was carried out assuming that the sample surface is irradiated by variable heating area in micrometer order using an amplitude modulated laser beam. Analyzed results show that the phase lag of the reflectance signal depends on not only the thermal effusivity but also on the thermal diffusivity of the film in local heating. Hence, the thermal conductivity determined by the thermal effusivity and the thermal diffusivity can be evaluated by the dependence of the phase lags on the heating area. This technique was applied for Cu(1-X)PtX (0≦X≦1.63 at%) films with 300 nm thickness deposited on glass substrates. The evaluated thermal conductivity varies from 340 W/(mK) to 97 W/(mK) with increasing Pt concentration. We found that the thermal conductivity of the Cu thin film becomes less than 90% of that of the bulk value (~400 W/(mK)). Moreover, the evaluated thermal conductivity was confirmed to correspond well to the electric conductivity with the Wiedemann-Franz law.