Abstract
Ultra-precision machined surface such as semiconductor wafer are highly demanded nowadays. However, because of shrinking design rules of the semiconductor, it is uprising the difficulty of detecting nano-defects. To keep process yield in manufacture line, we must develop a defect measurement system with higher resolution, throughput, non-destructiveness and robustness. As such a measurement system, we have proposed the application of the structured light illumination (SLI) microscopy. The proposed method is optical inspection system and that resolution exceeds the diffraction limit. Conventional proposed method has a difficulty about imaging system. Despite the imaging system is coherent system, the imaging system required in conventional super-resolution algorithm is incoherent system. In third report, we propose new super-resolution algorithm based on coherent imaging system, and three-light-flux interference standing wave illumination that enables new algorithm usage. To verify new proposed method, we carried out computer simulation comparing new method and conventional method. As the result, superiority of new method is confirmed. And improvement of new method robustness by increasing standing wave shift times is also confirmed.
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