Abstract
Cu foils for circuit board manufacturing in microelectronics are produced using electrodeposition method from copper (II) sulfate aqueous solutions containing various additives. Such additives as gelatine and chloride ion are added to form the deposit surface having a periodic roughness. However, the composition in the electrodeposition bath and electrolytic current are the product of empirical research and the actions of these additives are still far from being fully understood. In this study, the effects of gelatine and chloride ion on copper electrodeposition were investigated. The surface morphology and crystal orientation of the deposits were examined by SEM and XRD. The copper deposits from the electrolyte containing gelatine and chloride ion grew in the ‹110› direction and columnar structures were formed. Moreover, on the deposits surface, pyramidal shapes were observed. The sharpness of the pyramidal shape increased with an increase of the concentration of gelatine and chloride ion and an excessive addition of gelatine caused the decrease of the sharpness. These results suggest that chloride ion is adsorbed preferentially on the (220) plane and promotes the electrodeposition of copper on the plane, on the other hand, gelatine is adsorbed preferentially on the (111) plane and suppresses the electrodeposition on the plane.
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