Abstract
An alumina membrane with nano-sized pore array by anodic oxidation using the thin film aluminum deposited on silicon wafer was fabricated. It Is important that the sample prepared by metal deposition method has a flat aluminum surface and a good adhesion between the silicon wafer and the thin film aluminum. The oxidation time was controlled by observation of current variation. While the oxalic acid with 0.2 M was used for low voltage anodization under 100 V, the chromic acid with 0.1 M was used for high voltage anodization over 100 V. The nano-sized pores with diameter of <TEX>$60\~120$</TEX> nm was obtained by low voltage anodization of <TEX>$40\~80$</TEX> V and those of <TEX>$200\~300$</TEX> nm was obtained by high voltage anodization of <TEX>$140\~200$</TEX> V. The pore widening process was employed for obtaining the one-channel with flat surface because the pores of the alumina membrane prepared by the fixed voltage method shows the structure of two-channel with rough surface. Finally, the sample was immersed to the phosphoric acid with 0.1 M concentration to etching the barrier layer.
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More From: Journal of the Korean Institute of Electrical and Electronic Material Engineers
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