Abstract
There is an increasing interest in applications of wide-gap materials to high-temperature and high-power electronics. It is necessary to radiate extra heat efficiently through an aluminum heat sink coated with a heat-resistant material with high thermal conductivity. Diamond has the highest thermal conductivity in all materials, which at room-temperature is above 1000 W/mK. However, at high temperatures, diamond films show low adhesion to aluminum substrates due to a large difference in thermal expansion coefficient between diamond and aluminum.
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