Abstract
The aim of this paper is to focus on the development in the field of electronic ceramic materials, such as MnZn ferrites, multilayer ferrite chip components, and base metal electrode multilayer ceramic capacitors. There are many requirements for electronic ceramics, among which the reliability and low loss characteristics are of prime importance. New material technologies for ensuring high performance ferrites and highly reliable multilayer chip components are shown with special reference to the microstructure. For achieving high performance ferrite cores, adequate additives and control of nonstoichiometric oxygen content by firing conditions are quite important. Material technology for multilayer ferrite chip components are described with special reference to the behavior of silver during firing. Also, highly reliable multilayer ceramic capacitors with Ni electrodes have been developed by controlling chemical composition and grain boundary chemistry.
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