Abstract
A prototype circuit board with micro-metal patterns was fabricated by laser irradiation and an electrochemical technique. An aluminum specimen covered with porous type oxide films was irradiated with a pulsed laser beam, using a convex lens with a focal length of 10mm. The oxide film was removed in an irregularly shaped area, using a 1.5mm diameter laser beam, while the oxide film was removed in a circle with 5μm diameter, using a 1.0mm diameter laser beam, due to an aberration of the convex lens. The diameter of the film-removed area decreased with decreasing laser power and laser irradiation time. Laser irradiation with a beam expander and a doublet lens caused the removal of the oxide film in a circle with 3μm diameter. Fine metal patterns with 4μm line width was fabricated on the epoxy resin board by successive steps of aluminum anodizing, laser irradiation, electroplating, resin attaching, and removal of the aluminum substrate and oxide film.
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