Abstract
We have studied and learned that there are many advantages with the micro bump formation using the electroless plating method. Also the study on the usefulness of the process has been reported. This time we have experimented bonding TAB tapes on to the electroless plated bumps formed LCD driver IC. The results from the visual appearance seen from SEM photos and the break mode of the pull tests conducted on the bonded area shows that proper ILB conditions were found.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: Journal of Japan Institute of Electronics Packaging
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
