Abstract
In order to control the SiC content in Ni/SiC composite plating, cationic surface-active agents with different alkyl chain length, which were of the hydrophobic group, were added to a Ni/SiC composite plating bath to change the surface charge of the SiC particles from negative to positive. The influence of the cationic surfactant on the Ni plating was also studied. The crystallite size of Ni deposits decreased with the addition of the cationic surface-active agents, and an excess addition of cationic surface-active agents in the bath caused cracks in the Ni deposits. In the Ni/SiC plating, we can easily control the SiC amount in the Ni/SiC plating between about 10 and 30 vol%, changing the alkyl chain lengths of the added cationic surfactants and their concentration to change the surface potential of SiC particles.
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