Abstract
This paper presents a novel type of hybrid dispensing head for IC fabrication and surface mount technology. The proposed mechanism consists of solenoid valve and piezoelectric stack as actuators, and provides positive-displacement and jet dispensing. The positive-displacement dispensing can produce desired adhesive amount without viscosity effect, while the jet dispensing can produce high precision adhesive amount. In order to determine the relationship between required voltage of the piezoelectric actuator and needle displacement, both static and dynamic analysis are undertaken, In addition, finite element analysis is performed in order to find optimal design parameters. Dispensing flow rate and pressure in the chamber are evaluated through fluid dynamic model.
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